李兴权

作者: 时间:2020-04-06 点击数:

李兴权,博士,副教授,硕导,毕业于福州大学离散数学中心应用数学专业,获得2019年福建省优秀博士论文。主要从事图神经网络算法及其应用(GCN),机器学习优化算法(MLP),VLSI自动化物理和制造设计(EDA),机器学习优化算法。在先进制程技术下版图分解和布局研究取得一定研究成果,提出了基于离散松弛的三重版图分解算法、混合高度标准单元合法化算法、考虑时延的填充物插入算法。主持国家自然科学基金青年项目一项,参与国家自然科学基金面上项目多项。在国际顶级(CCF A类)期刊IEEE TC,国际一流(CCF B类)期刊IEEE TVLSI、ACM TODAES,国际主流(CCF C类)期刊Integration、SuperComp.;国际顶级会议ICCAD,国际一流会议ASP-DAC、ISPD、ISVLSI、ASICON上发表二十余篇论文。申请中国发明专利和软件著作权多项。两次带队获得国际计算机辅助设计竞赛(ICCAD@CAD Contest)全球第一名(中国大陆首次获得),指导本科生和研究生参加数学建模竞赛获全国一等奖和二等奖多项,指导本科生参加国家大学生创新创业项目多项。在2019年亚太设计自动化会议上做30分钟报告。

个人主页:https://www.researchgate.net/profile/Xingquan_Li

       https://dblp.uni-trier.de/pers/hd/l/Li:Xingquan

在研项目:

1、面向先进制程的VLSI混合高单元布局算法研究,国家自然科学基金面上项目(No. 61907024),2020.1—2022.12,25万,主持

2、VLSI混合高度标准单元布局算法研究,闽南师范大学博士科研启动项目(No.KJ18009),2018.10—2022.9,10万,主持

3、基于热传导方程的超大规模集成电路布局模型及快速算法研究,国家自然科学基金面上项目(No. 61672005),2017.1—2020.12,50万,参与

代表作:

1、Xingquan Li, Ziran Zhu and Wenxing Zhu, DSA guiding template assignment with multiple redundant via and dummy via insertion,Integration, the VLSI Journal, 2020, 66: 32-42. (CCF-C)

2、Xingquan Li, Cong Cao, and Tao Zhang, Block diagonal dominance‐based dynamic programming for detecting community,The Journal of Supercomputing, 2020. (CCF-C)

3、Xingquan Li, Bei Yu, Jianli Chen and Wenxing Zhu, “Redundant Via Insertion and DSA Guiding Template Assignment with Dummy Via,”IEEE/ACM Asia South Pacific Design Automation Conference, January, 2019.(CCF-C)

4、Xingquan Li, Jianli Chen, Yuhang Chen, Ziran Zhu, Wenxing Zhu and Yao-Wen Chang, “Analytical Mixed-Cell-Height Legalization Considering Average and Maximum Movement Minimization,”IEEE International Symposium on Physical Design (ISPD), March, 2019.(CCF-C)

5、Xingquan Li, Bei Yu, Jiaojiao Ou, Jianli Chen, David Z. Pan and Wenxing Zhu, “Graph Based Redundant Via Insertion and Guiding Template Assignment for DSA-MP,”IEEE Transactions on Very Large Scale Integration Systems (TVLSI),vol. 26, no. 11, pp. 2504–2517, 2018.(CCF-B)

6、Xingquan Li, Jianli Chen and Wenxing Zhu, “Discrete Relaxation Method for Contact Layer Decomposition of DSA with Triple Patterning,”Integration, the VLSI Journal,Vol. 61, no. 1, pp. 77–87, 2018.(CCF-C)

7、Xingquan Li, Ziran Zhu and Wenxing Zhu, “Discrete Relaxation Method for Triple Patterning Lithography Layout Decomposition,”IEEE Transactions on Computers (TC),vol. 66, no. 2, pp. 285–298, 2017.(CCF-A)

8、Xingquan Li and Wenxing Zhu, “Two-Stage Layout Decomposition for Hybrid E-Beam and Triple Patterning Lithography,”ACM Transactions on Design Automation of Electronic Systems (TODAES),vol. 23, no. 1, pp. 6:1– 6:23, 2017.(CCF-B)

9、Ziran Zhu, Xingquan Li, Yuhang Chen, Jianli Chen, Wenxing Zhu, Yao-Wen Chang, Mixed-Cell-Height Legalization Considering Technology and Region Constraints,IEEE/ACM International Conference on Computer-Aided Design (ICCAD),2018.(CCF-B)

10、Jianli Chen, Peng Yang, Xingquan Li, Wenxing Zhu, Yao-Wen Chang, Mixed-Cell-Height Placement with Complex Minimum-Implant-Area Constraints,IEEE/ACM International Conference on Computer-Aided Design (ICCAD),2018.(CCF-B)

11、Hao Geng, Haoyu Yang, Bei Yu, Xingquan Li, Xuan Zeng, Sparse VLSI Layout Feature Extraction: A Dictionary Learning Approach,IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Hong Kong, 2018.(CCF-C)

12、Ye Huang, Xingquan Li, Wenxing Zhu, Jianli Chen, Cut Redistribution and DSA Template Assignment for Unidirectional Design,IEEE 12th International Conference on ASIC (ASICON), 2017.

13、Tingshen Lan, Xingquan Li, Jianli Chen, Jun Yu, Lei He, Shenhua Dong, Wenxing Zhu, Yao-Wen Chang, Timing-Aware Fill Insertions with Design-Rule and Density Constraints,IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2019.(CCF-B)

学术奖励:

1、李兴权,福建省优秀博士学位论文,福建省教育厅,2019.

2、Xingquan Li#* (1/8), International Conference on Computer-Aided Design 2018 Contest at Timing-Aware Fill Insertion, 1st Place.

(2018国际计算机辅助设计竞赛全球第一名), IEEEE CAS/CEDA, ACM Sigda,学术竞赛,国际学术奖, 2018.11.6.

3、Xingquan Li(4/7), International Conference on Computer-Aided Design 2017 Contest at Multi Deck Legalization, 1st place.

(2017国际计算机辅助设计竞赛全球第一名), IEEEE CAS/CEDA, ACM Sigda,学术竞赛,国际学术奖, 2017.

2017博士国家研究生奖学金,2017.


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